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DeepWeave

AI optimization for backend chip design

Raised to date

$6.2M

of $6.4M offered across 1 Form D filing

Still open
$150K
Investors
19
Last filed
Apr 8, 2026

About

DeepWeave builds AI-native semiconductor design optimization software. Its DeepWeave Loom platform applies machine learning and holistic design-technology co-optimization to backend IC design, improving power, performance, and area (PPA) instead of optimizing individual design steps one at a time. The product plugs into existing EDA toolchains and process design kits, and it is live with design partners. DeepWeave raised a pre-seed round led by Root Ventures.

Optimizes backend chip design holistically for better PPA outcomes rather than just speeding up design, and fits into existing EDA workflows without requiring workflow changes. It is led by an ex-Google engineering leader and a UT Austin EDA professor.

Funding

  • EquityFiled Apr 8, 2026Form D
    $6.2M/ $6.4M

Product

DeepWeave Loom

Electronic design automation (EDA) software

A backend IC design optimization platform that uses AI-driven, holistic design-technology co-optimization to generate chip designs with improved power, performance, and area.

  • Holistic PPA (power, performance, area) optimization
  • Integrates into existing EDA toolchains without workflow changes
  • Works with current process design kits

Built for

Semiconductor design teams at foundries and fabless chip companies

People on file