Skip to content
Companies

Lux Semiconductors

Metal-core substrates for chip packaging

Raised to date

$2.9M

of $2.9M offered across 1 Form D filing

Last filed
Apr 3, 2025

About

Lux Semiconductors, Inc. is a forward-thinking microelectronics company that specializes in advanced semiconductor packaging solutions. The company’s innovative approaches focus on overcoming critical challenges in size, weight, thermal management, and power efficiency needed for modern electronic systems.

Lux's proprietary metal-core substrate technology significantly improves performance metrics over traditional materials.

Funding

  • EquityFiled Apr 3, 2025Form D
    $2.9M/ $2.9M

Product

System-on-Foil platform

Semiconductor Packaging

The System-on-Foil platform is designed to replace traditional organic and glass substrates with innovative metal-core substrates, enhancing the thermal management and performance capabilities of electronic systems. This product utilizes advanced technologies and engineering to deliver superior results in demanding applications.

  • High thermal conductivity (up to 100 times greater than glass)
  • Low loss interconnects for advanced millimeter-wave RF applications
  • Patented Coaxial Through Metal Vias technology for exceptional electromagnetic shielding and power delivery

Built for

High-performance electronics manufacturers

People on file