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Interconnect semiconductor platform
A rack-scale interconnect platform that transmits data as RF over a plastic dielectric waveguide, packaged as Active RF Cables (ARCs) for connecting accelerators and switches inside AI clusters.
- RF data transmission over plastic dielectric waveguide rather than copper or fiber
- Roughly 50% lower power and cost than comparable optical cable
- Picosecond-class latency, cited as up to 1000x lower than optical alternatives
- Rack-scale reach for AI/ML scale-up fabrics
- Demonstrated publicly at OCP 2025
Built for
Hyperscale data center and AI infrastructure operators, plus the cable, module and system vendors that supply them; also telecom carriers, cable internet providers and 5G/6G infrastructure builders.